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Abbreviated Journal Title

Appl. Phys. Lett.

Keywords

Bonding Processes; Carbon Nanotubes; Copper; Electrodeposition; Electrolytes; Nanocomposites; Particle Reinforced Composites; Tensile; Strength; Electrical-Properties; Physics; Applied

Abstract

Experimental results of carbon nanotube (CNT) reinforced copper composites (Cu/CNT) have shown that the resultant tensile strength of Cu/CNT composite is CNT diameter dependent, in a form of parabolic relationship that the smaller the CNT diameters the greater the resultant strength of the Cu/CNT composites. The largely increased strength of Cu/CNT composited is attributed to the good CNT dispersion in both the electrolyte and in composite after electrochemical deposition, as well as to the good interfacial bonding formed by the electrochemical deposition process. Smaller CNT diameters result in greater total interfacial bonding area thus the greater resultant strength of the composite.

Journal Title

Applied Physics Letters

Volume

95

Issue/Number

2

Publication Date

1-1-2009

Document Type

Article

Language

English

First Page

3

WOS Identifier

WOS:000268089200016

ISSN

0003-6951

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