Title

RF SAW filter package design for wireless communications

Authors

Authors

C. Finch; X. M. Yang; T. X. Wu;B. Abbott

Abbreviated Journal Title

Microw. Opt. Technol. Lett.

Keywords

RF SAW filter; electronic packaging; finite-element method; Engineering, Electrical & Electronic; Optics

Abstract

This paper describes a new method to design a ceramic chip and wire package for an RF SAW filter. Both the solid model of the package and bond wires are included in the full-wave analysis. A novel port configuration is used in finite-element simulation. Agreement between measurement and simulation is found to be excellent. (C) 2003 Wiley Periodicals, Inc.

Journal Title

Microwave and Optical Technology Letters

Volume

39

Issue/Number

5

Publication Date

1-1-2003

Document Type

Article

DOI Link

http://dx.doi.org/10.1002/mop.11229

Language

English

First Page

399

Last Page

401

WOS Identifier

WOS:000186081400016

ISSN

0895-2477

Recommended Citation

"RF SAW filter package design for wireless communications" (2003). Faculty Bibliography 2000s. 3749.
https://stars.library.ucf.edu/facultybib2000/3749