RF SAW filter package design for wireless communications
Abbreviated Journal Title
Microw. Opt. Technol. Lett.
RF SAW filter; electronic packaging; finite-element method; Engineering, Electrical & Electronic; Optics
This paper describes a new method to design a ceramic chip and wire package for an RF SAW filter. Both the solid model of the package and bond wires are included in the full-wave analysis. A novel port configuration is used in finite-element simulation. Agreement between measurement and simulation is found to be excellent. (C) 2003 Wiley Periodicals, Inc.
Microwave and Optical Technology Letters
"RF SAW filter package design for wireless communications" (2003). Faculty Bibliography 2000s. 3749.