Elucidating Cu-glycine and BTA complexations in Cu-CMP using SIMS and XPS
Abbreviated Journal Title
Electrochem. Solid State Lett.
CHEMICAL-MECHANICAL PLANARIZATION; CORROSION-INHIBITORS; COPPER; BENZOTRIAZOLE; PEROXIDE; ELECTROCHEMISTRY; SPECTROSCOPY; Electrochemistry; Materials Science, Multidisciplinary
The role of oxidants, complexing agents, and inhibitors in copper surface modification during Cu-chemical mechanical planarization (CMP) process was studied using secondary ion mass spectroscopy (SIMS) and X-ray photoelectron spectroscopy (XPS). The changes in the Cu surface chemistry in the presence of hydrogen peroxide, glycine, and benzotriazole (BTA) were investigated, with a special attention to the effect of pH, Cu-glycine-, and Cu-BTA-complex formations. The present investigation corroborates the earlier reported results of an increased copper dissolution in solution containing glycine and hydrogen peroxide, and a decreased removal rate of copper in the presence of benzotriazole due to the formation of a Cu-BTA polymeric film. (C) 2005 The Electrochemical Society.
Electrochemical and Solid State Letters
"Elucidating Cu-glycine and BTA complexations in Cu-CMP using SIMS and XPS" (2005). Faculty Bibliography 2000s. 5120.