Design of a Dual Latent Heat Sink for Pulsed Electronic Systems
Abbreviated Journal Title
J. Thermophys. Heat Transf.
STORAGE; EXCHANGER; MODES; Thermodynamics; Engineering, Mechanical
A conceptual design of a dual latent heat sink basically intended for low thermal duty cycle electronic heat sink applications is presented. In addition to the concept, end-application-dependent criteria to select an optimized design for this dual latent heat sink are presented. A thermal resistance model has been developed to analyze and optimize the design, which would also serve as a fast design tool for experiments. The model showed that it is possible to have a dual latent heat sink design capable of handling 7 MJ of thermal load at a heat flux of 500 W/cm(2) (over an area of 100 cm(2)) with a volume of 0.072 m(3) and a weight of about 57.5 kg. It was also found that, with such high heat flux absorption capability, the proposed conceptual design can have a vapor-to-condenser temperature difference of less than 10 degrees C with a volume storage density of 97 MJ/m(3) and a mass storage density of 0.122 MJ/kg.
Journal of Thermophysics and Heat Transfer
"Design of a Dual Latent Heat Sink for Pulsed Electronic Systems" (2008). Faculty Bibliography 2000s. 565.