Title

Investigation of diode geometry and metal line pattern for robust ESD protection applications

Authors

Authors

Y. Li; J. J. Liou;J. Vinson

Comments

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Abbreviated Journal Title

Microelectron. Reliab.

Keywords

Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Physics, Applied

Abstract

The effect of different diode geometries and metal patterns on the failure current It2 is investigated experimentally. The devices considered are N+/P well LOCOS diodes having different lengths, widths, finger numbers, and metal connections. The results provide useful insights into optimizing the diode for robust electrostatic discharge (ESD) protection applications. (C) 2008 Elsevier Ltd. All rights reserved.

Journal Title

Microelectronics Reliability

Volume

48

Issue/Number

10

Publication Date

1-1-2008

Document Type

Article

Language

English

First Page

1660

Last Page

1663

WOS Identifier

WOS:000259844900007

ISSN

0026-2714

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