Title

Vertical-via interconnection for infrared antennas

Authors

Authors

T. A. Mandviwala; B. A. Lail;G. D. Boreman

Comments

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Abbreviated Journal Title

J. Vac. Sci. Technol. B

Keywords

MICROBOLOMETERS; DIPOLE; Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Physics, Applied

Abstract

The authors present fabrication process details and test data for a vertical-via. interconnection suitable for low-frequency signal extraction from infrared antenna-coupled sensors. Electrical readout of the signal from an antenna-coupled bolometer was accomplished using two 300 nm diameter Au via structures that extended 300 nm in the vertical direction. These vertical vias passed through two isolation layers of SiO2 and through a 1500 X 600 nm(2) cutout in a ground plane. Electromagnetic, isolation of the antenna from its associated electrical-readout bondpads at 28.3 THz in the infrared was demonstrated by mapping the two-dimensional spatial response of the antenna and comparing it to spatial response data from a similar structure without the intervening ground plane. (c) 2006 American Vacuum Society.

Journal Title

Journal of Vacuum Science & Technology B

Volume

24

Issue/Number

6

Publication Date

1-1-2006

Document Type

Article

Language

English

First Page

2612

Last Page

2615

WOS Identifier

WOS:000243324400021

ISSN

1071-1023

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