Vertical-via interconnection for infrared antennas
Abbreviated Journal Title
J. Vac. Sci. Technol. B
MICROBOLOMETERS; DIPOLE; Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Physics, Applied
The authors present fabrication process details and test data for a vertical-via. interconnection suitable for low-frequency signal extraction from infrared antenna-coupled sensors. Electrical readout of the signal from an antenna-coupled bolometer was accomplished using two 300 nm diameter Au via structures that extended 300 nm in the vertical direction. These vertical vias passed through two isolation layers of SiO2 and through a 1500 X 600 nm(2) cutout in a ground plane. Electromagnetic, isolation of the antenna from its associated electrical-readout bondpads at 28.3 THz in the infrared was demonstrated by mapping the two-dimensional spatial response of the antenna and comparing it to spatial response data from a similar structure without the intervening ground plane. (c) 2006 American Vacuum Society.
Journal of Vacuum Science & Technology B
"Vertical-via interconnection for infrared antennas" (2006). Faculty Bibliography 2000s. 6400.