Substrate noise coupling in a complex mixed signal integrated circuit

Abstract

In order to continue shrinking the size of electronic devices, it has become necessary to integrate both analog and digital components on a signle substrate to form a mixed signal integrated circuit. With this tight integration has come the problem of substrate noise coupling between the devices on the substrate. Research has been done to examine the effect of this coupling in simple test structures, but as yet no complex circuits have been tested. In this work, the relatively complex Digital Phased-Locked Loop will be stimulated with several different substrate models to see what effect substrate coupling has on the functioning of the circuit. The simulations involve the comparison of lightly doped and heavily doped substrates using both Silicon on Insulator and Capcitive Guard Ring noise reduction techniques. Circuits are tested at both high and low frequency. The high level performance characteristics such as lock time and pull-in time are compared, as well as some low level circuit characteristics. The results indicate a complex situation with some components of the circuit being affected more by the substrate coupling, and some sub-circuits having a greater effect on the high level performance of the overall circuit. Recommendations have been made as to what substrate reduction techniques were best in what types of situations.

Notes

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Thesis Completion

1997

Semester

Spring

Advisor

Malocha, Donald C.

Degree

Bachelor of Science (B.S.)

College

College of Engineering

Degree Program

Electrical Engineering

Subjects

Dissertations, Academic -- Engineering;Engineering -- Dissertations, Academic

Format

Print

Identifier

DP0021515

Language

English

Access Status

Open Access

Length of Campus-only Access

None

Document Type

Honors in the Major Thesis

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