A one-piece, microfluidic package with standardized multiple ports allows devices to be connected in series without resorting to extra tubing connections or bonding 5 processes. The one-piece construction consists of microfluidic channels that can be connected to fluid reservoirs and other fluidic components fabricated with interconnecting and interlocking ports. The size of the friction-fit interlocking ports is designed such that the smaller male port fits snugly into the larger female port in a manner that is leak-free and adhesive-fiee. The friction-fit ports can also be 10 reconfigured. Thus, the interconnection of microfluidic packages can be in an extended series including connections to sensors and devices such as a bio/biochemical/chemical sensor chip, a dielectrophoretic manipulator chip, and a microfluidic reactor chip.
Application Serial Number
Assignee at Issuance
College of Engineering and Computer Science (CECS)
Mechanical and Aerospace Engineering
Assignee at Filing
Nonprovisional Application Record
Cho, Hyoung, "Interconnecting Microfluidic Package and Fabrication Method DIV" (2011). UCF Patents. 276.