Abstract

A silica-based nanoformulation and method is used to treat citrus canker, inhibit the growth of mold and mildew, and add nutrients to soil used for agricultural purposes. The nanotechnology-enabled copper-loaded, silica nanoformulation (CuSiNP/NG) design is a "revolutionary re-invention" of Cu for safe application because it provides a formulation with maximum abundance ionic Cu, provides sustained and optimal Cu ion release for long-term disease protection, better adherence to plant surfaces and structural surfaces due to gel-based nanostructureof CuSiNG, thus avoiding multiple spray applications and reducing the amount of Cu used in comparison to existing Cu compounds without compromising anitbaterial activity. Thus, the silica-based nanoformulation releases copper in non-toxic quantities to the environment and the silica matrix provides an enivornmentally safe host material with a flexible design that is optimized to provide specific antifungal and antibaterial remediation using infrequent applications.

Document Type

Patent

Patent Number

US 8,221,791 B1

Application Serial Number

12/332,021

Issue Date

7-17-2012

Current Assignee

UCFRF

Assignee at Issuance

UCFRF

College

NanoScience Technology Center

Department

NanoScience Technology Center

Allowance Date

3-15-2012

Filing Date

12-10-2008

Assignee at Filing

UCFRF

Filing Type

Nonprovisional Application Record

Donated

no

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