Abstract

Our wafer scale processing techniques produce chip-laser-diodes with a diffraction grating (78) that redirects output light out the top (88) and/or bottom surfaces. Generally, a diffraction grating (78) and integrated lens-grating (78) are used herein to couple light from the chip to an output fiber (74), and the lens-grating (78) is spaced from the diffraction grating (76). Preferably the diffraction grating (76) and integrated lens grating (78) are also used to couple light from the output fiber (74) back to the active region of the chip. The integrated lens-grating (78) can be in a coupling block (82). The use of a coupling block (82) can eliminate "facet-type damage". A coupling block (82) is generally used herein to couple light from the chip to an output fiber (74), and preferably to couple feedback reflected from the fiber (74) back to the chip.

Document Type

Patent

Patent Number

US 7,194,016 B2

Application Serial Number

10/472,012

Issue Date

3-20-2007

Current Assignee

Joint Assignment w/UCFRF: Infinite Photonics, Inc.

Assignee at Issuance

Joint Assignment w/UCFRF: Infinite Photonics, Inc.

College

College of Optics and Photonics

Department

CREOL

Allowance Date

6-16-2006

Filing Date

9-19-2003

Assignee at Filing

Joint Assignment w/UCFRF: Infinite Photonics, Inc.

Filing Type

Nonprovisional Application Record

Donated

no

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