Abstract
A conduction structure for infrared microbolometer sensors and a method for sensing electromagnetic radiation may be provided. The microbolometer may include a first conductor layer and a second conductor layer. The microbolometer futher may include a bolometer layer between the first conductor layer and the second conductor layer. A thermal camera also may be provided using the microbolometer.
Document Type
Patent
Patent Number
US 7,633,065 B2
Application Serial Number
11/583,210
Issue Date
12-15-2009
Current Assignee
Joint Assignment w/UCFRF: Sensormatic Electronics Corporation
Assignee at Issuance
Joint Assignment w/UCFRF: Sensormatic Electronics Corporation
College
Advanced Materials Processing & Analysis Center (AMPAC)
Department
Advanced Materials Processing & Analysis Center (AMPAC)
Allowance Date
10-6-2009
Filing Date
10-19-2006
Assignee at Filing
Joint Assignment w/UCFRF: Sensormatic Electronics Corporation
Filing Type
Nonprovisional Application Record
Donated
no
Recommended Citation
Coffey, Kevin and Lian, Ming-Ren, "Conduction structure for infrared microbolometer sensors" (2009). UCF Patents. 795.
https://stars.library.ucf.edu/patents/795