Keywords

Thermionic emission

Abstract

This thesis addresses the problem of extracting heat from sealed electronic enclosures. Typical industry practice is to use various air-to-air and air-to-liquid heat exchangers. These techniques are known to require costly custom designs. This thesis points out how one can apply heat pipe technology in the form of a vapor chamber to solve this type of problem. The details on the design and testing of two prototype vapor chambers are cited. Included in the text are typical industrial applications that require sealed enclosures to protect their associated electronic control hardware. Also mentioned is some historical background on heat pipes.

Notes

If this is your thesis or dissertation, and want to learn how to access it or for more information about readership statistics, contact us at STARS@ucf.edu

Graduation Date

1976

Advisor

Evans, Ronald D.

Degree

Master of Science (M.S.)

College

College of Engineering

Degree Program

Engineering

Format

PDF

Pages

viii, 85 pages

Language

English

Rights

Written permission granted by copyright holder to the University of Central Florida Libraries to digitize and distribute for nonprofit, educational purposes.

Length of Campus-only Access

None

Access Status

Masters Thesis (Open Access)

Identifier

DP0008162

Subjects

Thermionic emission

Collection (Linked data)

Retrospective Theses and Dissertations

Included in

Engineering Commons

Share

COinS