Systems that consume and convert energy produce thermal energy as a byproduct. This generation of thermal energy, if not dissipated properly, contributes to the significant temperature rise of the overall system. This temperature rise can lead to reduced efficiency and system-level failure. Future technologies will continue to face such thermal challenges. In fact, next-gen devices will demand flexible thermal management architectures for high-performance operation. To tackle these challenges, innovative liquid cooling technologies and high-speed thermal diagnostic systems must be developed simultaneously. Active and passive pulsation-liquid-cooling techniques are currently an attractive thermal management solution. In an active cooling mode, the influence of pulsation on heat transfer enhancement using liquid jets is understood, fairly well both theoretically and experimentally. However, the thermal diagnostic systems for characterizing these cooling methods fall short for many reasons including that the conventional thermal cameras have limited temporal and spatial resolutions. To solve this problem and capture high thermal transients, a low-cost thermal mapping technique using Quantum-dots is developed. In parallel to active cooling solutions, passive cooling technologies have come a long way due to their capability of hot spot mitigation. However, challenges remain in thermal diagnostics and the fabrication methodologies – especially for the next-gen of flexible and 3D electronic packages. To solve these problems, firstly, research efforts are pursued to come up with i) a fabrication process that is easy, cheap and repeatable and ii) an innovative design with modular features that makes it suitable for double-sided cooling configuration. Secondly, experimental testing is pursued to reveal the flow and thermal kinetics for different condensation conditions. This work identified many design, fabrication, and thermal performance limitations tied to planar, flexible and stacked-3D pulsating heat pipes that can also incorporate multi-phase coolants such as the combination of paraffin wax and water-ethanol fluid mixtures.
Doctor of Philosophy (Ph.D.)
College of Engineering and Computer Science
Mechanical and Aerospace Engineering
Length of Campus-only Access
Doctoral Dissertation (Open Access)
Rabbi, Khan Mohammad, "A Flexible 3D Architecture for Cooling Future Generation Devices" (2022). Electronic Theses and Dissertations, 2020-. 1641.