A Fully-Integrated Flexible Photonic Platform for Chip-to-Chip Optical Interconnects
Abbreviated Journal Title
Anat. Sci. Educ.
Data communications; energy per bit; optical interconnects; optical; waveguides; WAVE-GUIDES; CHALCOGENIDE GLASS; SILICON PHOTONICS; CIRCUIT-BOARD; FABRICATION; RESONATORS; CMOS; Engineering, Electrical & Electronic; Optics; Telecommunications
We analyze a chip-to-chip optical interconnect platform based on our recently developed flexible substrate integration technology. We show that the architecture achieves high bandwidth density (100 Tbs/cm(2)), and does not require optical alignment during packaging. These advantages make the flexible photonics platform a promising solution for chip-to-chip optical interconnects. We further report initial experimental characterizations of the flexible photonics platform fabricated using thermal nanoimprint patterning of glass waveguides and III-V die bonding.
Journal of Lightwave Technology
J. Lightwave Technol.
"A Fully-Integrated Flexible Photonic Platform for Chip-to-Chip Optical Interconnects" (2013). Faculty Bibliography 2010s. 4299.