3D Printing; Fused Deposition Modeling; Composite Material; Electromechanics


As an attempt to improve the overall cost-effectiveness and ease of structural electronics manufacturing, this study characterizes the mechanical and electrical responses of structures which are fabricated from a novel metallopolymer composite material by fused deposition modeling as they are subjected to quasi-static, uniaxial mechanical tension. Baseline values of tensile properties and electrical resistivity were first obtained via ASTM D638-22 standard testing procedures and linear sweep voltammetry (LSV), respectively. A hybrid procedure to measure in-situ mechanically dependent electrical behavior was subsequently developed and implemented. The mechanical and electromechanical testing was followed by the derivation of stochastic values for several mechanical and electrical properties of the printed structures.

The mean values of a three-specimen sample’s ultimate tensile strength and tensile modulus were 8.76 and 244.5 megapascals, respectively, and the sample exhibited significant ductility through an average tensile elongation of 70.4 percent at fracture. The electrical resistance of test specimens appeared to be positively correlated to their mechanical strain. Correlation coefficients exceeding 0.95 were obtained for simple linear regression models of the resistance-strain curves for their two distinct regimes of strain sensitivity. The uncoupled mechanical and electrical performance of the printed structures were, however, significantly below what the nominal material properties suggested. Thus, it was concluded that the process of component manufacturing should be further improved, and that the structures’ mechanical and electromechanical behaviors should be more rigorously characterized, before attempting to use such components in applications of structural electronics.

Thesis Completion Year


Thesis Completion Semester


Thesis Chair

Wu, Dazhong


College of Engineering and Computer Science


Department of Mechanical and Aerospace Engineering

Thesis Discipline

Mechanical Engineering



Access Status

Open Access

Length of Campus Access


Campus Location

Orlando (Main) Campus