Abstract

A method is provided for immobilizing a semiconductor or noble metal material on a selected support material. In accordance with the method, the support is treated with a first solvent to clean and prepare the surface of the support. A powder slurry including fine particles of the semiconductor in a second solvent is then formed. The resultant slurry is applied to surface of the support. Subsequently, the slurry on the surface of the support is dried at room temperature to remove the second solvent to achieve an intermediate type of bonding between the semiconductor and the support surface.

Document Type

Patent

Patent Number

US 5,246,737

Application Serial Number

07/843,184

Issue Date

9-21-1993

Current Assignee

UCFRF

Assignee at Issuance

UCFRF

College

Florida Solar Energy Center (FSEC)

Department

FSEC

Allowance Date

6-22-1993

Filing Date

2-28-1992

Assignee at Filing

UCFRF

Filing Type

Nonprovisional Application Record

Donated

no

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