Abstract

The present invention provides an optical interconnection platform, comprising a substrate, a plurality of integrated circuits attached to a surface of the substrate wherein each integrated circuit having an array of transmitters and an array of receivers, an optical integrated circuit module attached to an opposing surface of the substrate wherein the optical integrated circuit module comprising a highly transparent photosensitive material having an input microlens that collimate the light beams before entering the optical integrated circuit module and an output microlens that focuses the light beams into the array of receivers, and input and output Bragg diffractive gratings that are formed inside of the optical integrated circuit module.

Document Type

Patent

Patent Number

US 7,277,611 B1

Application Serial Number

11/468,535

Issue Date

10-2-2007

Current Assignee

UCFRF

Assignee at Issuance

Agency: FUJITSU LIMITED

College

College of Optics and Photonics

Department

CREOL

Allowance Date

6-4-2007

Filing Date

8-30-2006

Assignee at Filing

Agency: FUJITSU LIMITED

Filing Type

Nonprovisional Application Record

Donated

no

Share

COinS