Title

Electromigration Subjected To Joule Heating Under Pulsed Dc Stress

Keywords

Duty factor; Electromigration; Joule heating; Mean-time-to-failure; Pulse-dc stress

Abstract

This article reports an electromigration-lifetime model that incorporates the effect of Joule heating under pulsed DC condition. This median-time-to-failure model accounts for applied current density, duty factor, frequency, thermal time constant, and interconnect geometry. The model predictions reported in this work agree very well with numerical simulation and experimental data over a wide range of current densities and frequencies. © 2001 Elsevier Science Ltd. All rights reserved.

Publication Date

12-1-2001

Publication Title

Solid-State Electronics

Volume

45

Issue

12

Number of Pages

2051-2056

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1016/S0038-1101(01)00185-X

Socpus ID

0035545598 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/0035545598

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