Test Pixels For High-Temperature Infrared Scene Projection

Keywords

Infrared; MEMS; Scene projector

Abstract

High pixel temperatures for IR scene projector arrays face materials challenges of oxidation, diffusion, and recrystallization. For cost effective development of new high-temperature materials, we have designed and fabricated simplified pixels for testing. These consist of resistive elements, traces, and bond pads sandwiched between dielectric layers on Si wafers. Processing involves a pad exposure etch, a pixel outline etch, and an undercut etch to thermally isolate the resistive element from the substrate. Test pixels were successfully fabricated by electron-beam lithography using a combination of wet and dry etching.

Publication Date

1-1-2015

Publication Title

Proceedings of SPIE - The International Society for Optical Engineering

Volume

9452

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1117/12.2177025

Socpus ID

84943328378 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84943328378

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