Abstract

A thermal conduction switch includes a thermally-conductive first member having a first thermal contacting structure for securing the first member as a stationary member to a thermally regulated body or a body requiring thermal regulation. A moveable thermally-conductive second member has a second thermal contacting surface. A thermally conductive coupler is interposed between the first member and the second member. At least one control spring is coupled between the first member and the second member. The control spring includes a NiTiFe comprising shape memory (SM) material that provides a phase change temperature <273 >K, a transformation range <40 >K, and a hysteresis of(displacement) between first and second member by at least 1 mm, such as 2 to 4 mm.

Document Type

Patent

Patent Number

US 7,752,866 B2

Application Serial Number

12/330,350

Issue Date

7-13-2010

Current Assignee

Joint Assignment w/UCFRF: National Aeronautics and Space Administration (NASA)

Assignee at Issuance

UCFRF

College

Advanced Materials Processing & Analysis Center (AMPAC)

Department

Advanced Materials Processing & Analysis Center (AMPAC)

Allowance Date

4-9-2010

Filing Date

12-8-2008

Assignee at Filing

UCFRF

Filing Type

Nonprovisional Application Record

Donated

no

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