Abbreviated Journal Title
J. Appl. Phys.
TRANSMISSION ELECTRON-MICROSCOPE; BOUNDARY-CHARACTER-DISTRIBUTION; METALLIC-FILMS; THIN-FILMS; SIZE; CONDUCTIVITY; ORIENTATION; DEPOSITION; BOOTSTRAP; SURFACES; Physics, Applied
The impact of electron scattering at surfaces and grain boundaries in nanometric polycrystalline tungsten (W) films was studied. A series of polycrystalline W films ranging in thickness from 10 to 310 nm and lateral grain size from 74 to 133 nm were prepared on thermally oxidized Si. The Fuchs-Sondheimer surface-scattering model and Mayadas-Shatzkes grain-boundary scattering model were employed for quantitative analyses. Predictions from the theoretical models were found to deviate systematically from the experimental data. Possible reasons for the failure of the theoretical models to describe the experimental data are explored. Finally, a discussion of the crucial features lacking from existing models is presented, along with possible avenues for improving the models to result in better agreement with experimental data.
Journal of Applied Physics
Choi, Dooho; Liu, Xuan; Schelling, Patrick K,.; Coffey, Kevin R.; and Barmak, Katayun, "Failure of semiclassical models to describe resistivity of nanometric, polycrystalline tungsten films" (2014). Faculty Bibliography 2010s. 5182.