Title

Thermal Impedance Model Of Electrostatic Discharge Effects On Microbolometers

Abstract

The small thermal mass of microbolometers, used in antenna-coupled infrared detectors, makes them especially vulnerable to electrical stress caused by electrostatic discharge (ESD). In this paper, an empirical thermal model, which is independent of the device geometry, is used to characterize the behavior of microbolometers under ESD conditions. The parameters of this thermal model are fitted to measurements made on the microbolometers, and a power-to-failure versus time-to-failure curve is obtained.

Publication Date

9-1-2000

Publication Title

Microwave and Optical Technology Letters

Volume

26

Issue

5

Number of Pages

291-293

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1002/1098-2760(20000905)26:5<291::AID-MOP5>3.0.CO;2-A

Socpus ID

0034272791 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/0034272791

This document is currently not available here.

Share

COinS