Title

Chemical mechanical planarization of copper: pH effect

Authors

Authors

T. Du;V. Desai

Abbreviated Journal Title

J. Mater. Sci. Lett.

Keywords

SLURRY; OXIDES; Materials Science, Multidisciplinary

Journal Title

Journal of Materials Science Letters

Volume

22

Issue/Number

22

Publication Date

1-1-2003

Document Type

Article

DOI Link

http://dx.doi.org/10.1023/a:1026353028626

Language

English

First Page

1623

Last Page

1625

WOS Identifier

WOS:000186270000019

ISSN

0261-8028

Recommended Citation

"Chemical mechanical planarization of copper: pH effect" (2003). Faculty Bibliography 2000s. 3719.
https://stars.library.ucf.edu/facultybib2000/3719