Chemical mechanical planarization of copper: pH effect

    Authors

    T. Du;V. Desai

    Abbreviated Journal Title

    J. Mater. Sci. Lett.

    Keywords

    SLURRY; OXIDES; Materials Science, Multidisciplinary

    Journal Title

    Journal of Materials Science Letters

    Volume

    22

    Issue/Number

    22

    Publication Date

    1-1-2003

    Document Type

    Article

    Language

    English

    First Page

    1623

    Last Page

    1625

    WOS Identifier

    WOS:000186270000019

    ISSN

    0261-8028

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