Vacuum Deposition Processes And The Properties Of Thin-Films

    Authors

    K. H. Guenther

    Comments

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    Abbreviated Journal Title

    Plat. Surf. Finish.

    Keywords

    ION; MICROSTRUCTURE; Metallurgy & Metallurgical Engineering; Materials Science, Coatings &; Films

    Abstract

    The particular process used for deposition of a thin film on a substrate has a definite influence on the microstructure of that film. For vacuum deposition processes (evaporation, sputtering, ion-assisted deposition, ion-beam sputtering, ion plating), the average energy of deposited particles has been found to be the single most important parameter determining the thin film microstructure. This is shown with electron micrographs of fractured thin film cross sections and simple two-dimensional computer simulations, based on a ballistic model. The simulations show basically the treelike growth structure characteristic of diffusion-limited aggregations for vacuum evaporation, and maximal dense packing of molecules characteristic of the glassy films that energetic particle deposition processes yield (ion-beam sputtering, low-voltage ion plating). The formation of dense, glassy films is phenomenologically described by an extension of well-known structure zone models-an additional zone representing deposition conditions favoring the formation of glassy films.

    Journal Title

    Plating and Surface Finishing

    Volume

    81

    Issue/Number

    4

    Publication Date

    1-1-1994

    Document Type

    Article

    Language

    English

    First Page

    68

    Last Page

    71

    WOS Identifier

    WOS:A1994NF47600016

    ISSN

    0360-3164

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