Title

Vacuum Deposition Processes And The Properties Of Thin-Films

Authors

Authors

K. H. Guenther

Comments

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Abbreviated Journal Title

Plat. Surf. Finish.

Keywords

ION; MICROSTRUCTURE; Metallurgy & Metallurgical Engineering; Materials Science, Coatings &; Films

Abstract

The particular process used for deposition of a thin film on a substrate has a definite influence on the microstructure of that film. For vacuum deposition processes (evaporation, sputtering, ion-assisted deposition, ion-beam sputtering, ion plating), the average energy of deposited particles has been found to be the single most important parameter determining the thin film microstructure. This is shown with electron micrographs of fractured thin film cross sections and simple two-dimensional computer simulations, based on a ballistic model. The simulations show basically the treelike growth structure characteristic of diffusion-limited aggregations for vacuum evaporation, and maximal dense packing of molecules characteristic of the glassy films that energetic particle deposition processes yield (ion-beam sputtering, low-voltage ion plating). The formation of dense, glassy films is phenomenologically described by an extension of well-known structure zone models-an additional zone representing deposition conditions favoring the formation of glassy films.

Journal Title

Plating and Surface Finishing

Volume

81

Issue/Number

4

Publication Date

1-1-1994

Document Type

Article

Language

English

First Page

68

Last Page

71

WOS Identifier

WOS:A1994NF47600016

ISSN

0360-3164

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