Immersion cooling of a simulated electronic chip protruding into a flow channel

    Authors

    J. E. Leland;L. C. Chow

    Comments

    Authors: contact us about adding a copy of your work at STARS@ucf.edu

    Abbreviated Journal Title

    J. Thermophys. Heat Transf.

    Keywords

    CRITICAL HEAT-FLUX; LIQUID; Thermodynamics; Engineering, Mechanical

    Abstract

    Nucleate boiling and critical heat flux from the top and side surfaces of a simulated electronic chip protruding into a rectangular channel has been studied. To ascertain the contributions of heat transfer from the sides and top of the simulated electronic chip, boiling from the sides was virtually eliminated by the use of a thin (0.025 mm) foil heater on top of a block of insulating material. It was found that single-phase heat transfer and critical heat flux are markedly greater for a surface protrusion height of 0.71 mm as compared to a hush surface. This increase was seen for flow velocities greater than 1 m/s and a subcooling of 20 degrees C. The results are compared to that for a copper block heated from below under similar fluid and geometry constraints. These comparisons show that the vapor emanating from the upstream side of the copper block plays an important role in either decreasing or increasing the critical heat flux. Additional results were obtained for the copper block where heal transfer from the upstream side was obstructed. These results indicate that under some conditions of subcooling and flow rate an optimal amount of upstream side vapor production exists.

    Journal Title

    Journal of Thermophysics and Heat Transfer

    Volume

    12

    Issue/Number

    3

    Publication Date

    1-1-1998

    Document Type

    Article

    Language

    English

    First Page

    398

    Last Page

    405

    WOS Identifier

    WOS:000074810100015

    ISSN

    0887-8722

    Share

    COinS