Future heat transfer concerns in Josephson junction computers

    Authors

    K. S. McFall;L. C. Chow

    Comments

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    Abbreviated Journal Title

    IEEE Trans. Compon. Packaging Technol.

    Keywords

    computers; cryogenics; heat dissipation; Josephson junction; superconducting; VLSI; RISC MICROPROCESSOR; RSFQ; RAM; SUPERCONDUCTOR; TECHNOLOGIES; FABRICATION; BICRYSTAL; DESIGN; MW; Engineering, Manufacturing; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary

    Abstract

    Using the superconducting properties of Josephson junctions enable extremely high switching speeds unmatched in semiconducting electronics. Much research has been conducted in recent decades in order to produce high performance electronics based on Josephson junction logic. In addition to the high speeds attainable by this technology, also of significance is the very low heat dissipated by Josephson circuits. Josephson devices have made great strides in the last ten years with microprocessors reaching levels of integration as high as 10(5) junctions/cm(2) Dissipation in these devices is easily managed, but integrations reaching 10(7) must be considered if Josephson electronics are to compete with the complexity and functionality of semiconducting electronics, Coupling this level of integration with dissipations of 0.34 and 2.98 mu W/junction in low and high temperature cases respectively, produces large heat fluxes difficult to remove at cryogenic temperatures, While other technical difficulties currently overshadow heat transfer concerns, the future of Josephson electronics research will likely need to address them.

    Journal Title

    Ieee Transactions on Components and Packaging Technologies

    Volume

    22

    Issue/Number

    3

    Publication Date

    1-1-1999

    Document Type

    Article

    Language

    English

    First Page

    378

    Last Page

    383

    WOS Identifier

    WOS:000083329100006

    ISSN

    1521-3331

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