Title

Future heat transfer concerns in Josephson junction computers

Authors

Authors

K. S. McFall;L. C. Chow

Comments

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Abbreviated Journal Title

IEEE Trans. Compon. Packaging Technol.

Keywords

computers; cryogenics; heat dissipation; Josephson junction; superconducting; VLSI; RISC MICROPROCESSOR; RSFQ; RAM; SUPERCONDUCTOR; TECHNOLOGIES; FABRICATION; BICRYSTAL; DESIGN; MW; Engineering, Manufacturing; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary

Abstract

Using the superconducting properties of Josephson junctions enable extremely high switching speeds unmatched in semiconducting electronics. Much research has been conducted in recent decades in order to produce high performance electronics based on Josephson junction logic. In addition to the high speeds attainable by this technology, also of significance is the very low heat dissipated by Josephson circuits. Josephson devices have made great strides in the last ten years with microprocessors reaching levels of integration as high as 10(5) junctions/cm(2) Dissipation in these devices is easily managed, but integrations reaching 10(7) must be considered if Josephson electronics are to compete with the complexity and functionality of semiconducting electronics, Coupling this level of integration with dissipations of 0.34 and 2.98 mu W/junction in low and high temperature cases respectively, produces large heat fluxes difficult to remove at cryogenic temperatures, While other technical difficulties currently overshadow heat transfer concerns, the future of Josephson electronics research will likely need to address them.

Journal Title

Ieee Transactions on Components and Packaging Technologies

Volume

22

Issue/Number

3

Publication Date

1-1-1999

Document Type

Article

Language

English

First Page

378

Last Page

383

WOS Identifier

WOS:000083329100006

ISSN

1521-3331

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