Modeling Of Coupled Interconnect Lines For Integrated-Circuits

    Authors

    J. S. Yuan; W. R. Eisenstadt;J. J. Liou

    Comments

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    Abbreviated Journal Title

    Int. J. Electron.

    Keywords

    TIME-DOMAIN; TRANSMISSION-LINES; MICROSTRIP LINES; DISPERSION; PARALLEL; Engineering, Electrical & Electronic

    Abstract

    A coupled interconnect model is developed using even mode and odd mode capacitance analysis. Signal coupling is presented in terms of interconnect width, substrate thickness, interconnect line spacing, and frequency. Picosecond photoconductor based measurements of coupled transmission lines on the integrated circuit support the even and odd mode signal transmission simulation results. SPICE circuit simulation is used to demonstrate the model utility and explore the sensitivity of the self- and mutual capacitances and inductances in signal crosstalk.

    Journal Title

    International Journal of Electronics

    Volume

    70

    Issue/Number

    4

    Publication Date

    1-1-1991

    Document Type

    Article

    Language

    English

    First Page

    751

    Last Page

    764

    WOS Identifier

    WOS:A1991FB71800008

    ISSN

    0020-7217

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