Title

Modeling Of Coupled Interconnect Lines For Integrated-Circuits

Authors

Authors

J. S. Yuan; W. R. Eisenstadt;J. J. Liou

Comments

Authors: contact us about adding a copy of your work at STARS@ucf.edu

Abbreviated Journal Title

Int. J. Electron.

Keywords

TIME-DOMAIN; TRANSMISSION-LINES; MICROSTRIP LINES; DISPERSION; PARALLEL; Engineering, Electrical & Electronic

Abstract

A coupled interconnect model is developed using even mode and odd mode capacitance analysis. Signal coupling is presented in terms of interconnect width, substrate thickness, interconnect line spacing, and frequency. Picosecond photoconductor based measurements of coupled transmission lines on the integrated circuit support the even and odd mode signal transmission simulation results. SPICE circuit simulation is used to demonstrate the model utility and explore the sensitivity of the self- and mutual capacitances and inductances in signal crosstalk.

Journal Title

International Journal of Electronics

Volume

70

Issue/Number

4

Publication Date

1-1-1991

Document Type

Article

Language

English

First Page

751

Last Page

764

WOS Identifier

WOS:A1991FB71800008

ISSN

0020-7217

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