3D Ordered Assemblies of Semiconductive Micro/Nanowires Using Microscale Fibrous Building Blocks

    Authors

    Y. Hong; Z. Y. Ma; C. M. Wang; L. Y. Ma;M. Su

    Comments

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    Abstract

    Three-dimensional (3D) ordered assemblies of semiconductive micro/nanowires are made by match-stick assembly of fibrous building blocks (FBBs). A glass tube filled with powders of starting material is processed drawn into centimeter-long, micrometer-diameter FBBs with controlled diameter and spacing. By repeating a draw-cut-stack process, the diameter and spacing of filling material can be programmably reduced from millimeters to hundred of nanometers. The FBBs are densely packed into 3D ordered structures such that wires in one layer are at define angle (theta) relative to those in the adjacent layer, where theta is between 0 and 180 degrees. The electrical measurements at bundled wires and single wire level confirm semiconducting behavior of wires. By directly manipulating microscale FBBs, the method allows high yield production of 3D ordered micro/nanowires with controlled and orientation enabling the construction of a new class of micro/nanomaterials.

    Journal Title

    Acs Applied Materials & Interfaces

    Volume

    1

    Issue/Number

    2

    Publication Date

    1-1-2009

    Document Type

    Article

    First Page

    251

    Last Page

    256

    WOS Identifier

    WOS:000267535700007

    ISSN

    1944-8244

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