Numerical Investigation of Flow and Heat Transfer Performance of Nano-Encapsulated Phase Change Material Slurry in Microchannels

    Authors

    S. Kuravi; K. M. Kota; J. H. Du;L. C. Chow

    Abbreviated Journal Title

    J. Heat Transf.-Trans. ASME

    Keywords

    heat transfer; microchannel flow; phase change materials; slurries; CHANGE MATERIAL SUSPENSIONS; POISEUILLE FLOW; CIRCULAR DUCTS; PARTICLES; LIQUID; Thermodynamics; Engineering, Mechanical

    Abstract

    Microchannels are used in applications where large amount of heat is produced. Phase change material (PCM) slurries can be used as a heat transfer fluid in microchannels as they provide increased heat capacity during the melting of phase change material. For the present numerical investigation, performance of a nano-encapsulated phase change material slurry in a manifold microchannel heat sink was analyzed. The slurry was modeled as a bulk fluid with varying specific heat. The temperature field inside the channel wall is solved three dimensionally and is coupled with the three dimensional velocity and temperature fields of the fluid. The model includes the microchannel fin or wall effect, axial conduction along the length of the channel, developing flow of the fluid and not all these features were included in previous numerical investigations. Influence of parameters such as particle concentration, inlet temperature, melting range of the PCM, and heat flux is investigated, and the results are compared with the pure single phase fluid.

    Journal Title

    Journal of Heat Transfer-Transactions of the Asme

    Volume

    131

    Issue/Number

    6

    Publication Date

    1-1-2009

    Document Type

    Article

    Language

    English

    First Page

    9

    WOS Identifier

    WOS:000266408100015

    ISSN

    0022-1481

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