Ultrasonic-assisted fabrication of highly dispersed copper/multi-walled carbon nanotube nanowires

Authors

    Authors

    Y. T. Peng;Q. F. Chen

    Comments

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    Abbreviated Journal Title

    Colloid Surf. A-Physicochem. Eng. Asp.

    Keywords

    Multi-walled carbon nanotube; Electroless copper plating; Ultrasonic; Nanowires; ELECTROLESS PLATING METHOD; NANOPARTICLES; COMPOSITES; NANOCOMPOSITES; NICKEL; SILVER; Chemistry, Physical

    Abstract

    Highly dispersed copper/multi-walled carbon nanotube (MWCNT) nanowires have been fabricated using ultrasonic-assisted electroless copper plating. The structures of the Cu/MWCNT nanowires were characterized by transmission electron microscopy (TEM), scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy-dispersive X-ray spectroscopy (EDX). The study clearly demonstrates the advantages of the ultrasonic technique on electroless copper plating on MWCNT, including an enhanced electroless copper deposition rate, improved interfacial bonding as well as preventing Cu/MWCNT nanowires from aggregating. (c) 2009 Elsevier B.V. All rights reserved.

    Journal Title

    Colloids and Surfaces a-Physicochemical and Engineering Aspects

    Volume

    342

    Issue/Number

    1-3

    Publication Date

    1-1-2009

    Document Type

    Article

    Language

    English

    First Page

    132

    Last Page

    135

    WOS Identifier

    WOS:000267095500021

    ISSN

    0927-7757

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