Title

Electromigration subjected to Joule heating under pulsed DC stress

Authors

Authors

W. Wu; J. S. Yuan; S. H. Kang;A. S. Oates

Comments

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Abbreviated Journal Title

Solid-State Electron.

Keywords

electromigration; Joule heating; pulse-dc stress; mean-time-to-failure; duty factor; MODEL; FAILURE; Engineering, Electrical & Electronic; Physics, Applied; Physics, ; Condensed Matter

Abstract

This article reports an electromigration-lifetime model that incorporates the effect of Joule heating under pulsed DC condition. This mediati-time-to-failure model accounts for applied current density, duty factor, frequency, thermal time constant, and interconnect geometry. The model predictions reported in this work agree very well with numerical simulation and experimental data over a wide range of current densities and frequencies. (C) 2001 Elsevier Science Ltd. All rights reserved.

Journal Title

Solid-State Electronics

Volume

45

Issue/Number

12

Publication Date

1-1-2001

Document Type

Article

DOI Link

http://dx.doi.org/10.1016/s0038-1101(01)00185-x

Language

English

First Page

2051

Last Page

2056

WOS Identifier

WOS:000172552900014

ISSN

0038-1101

Recommended Citation

"Electromigration subjected to Joule heating under pulsed DC stress" (2001). Faculty Bibliography 2000s. 3009.
https://stars.library.ucf.edu/facultybib2000/3009