Electromigration subjected to Joule heating under pulsed DC stress

    Authors

    W. Wu; J. S. Yuan; S. H. Kang;A. S. Oates

    Comments

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    Abbreviated Journal Title

    Solid-State Electron.

    Keywords

    electromigration; Joule heating; pulse-dc stress; mean-time-to-failure; duty factor; MODEL; FAILURE; Engineering, Electrical & Electronic; Physics, Applied; Physics, ; Condensed Matter

    Abstract

    This article reports an electromigration-lifetime model that incorporates the effect of Joule heating under pulsed DC condition. This mediati-time-to-failure model accounts for applied current density, duty factor, frequency, thermal time constant, and interconnect geometry. The model predictions reported in this work agree very well with numerical simulation and experimental data over a wide range of current densities and frequencies. (C) 2001 Elsevier Science Ltd. All rights reserved.

    Journal Title

    Solid-State Electronics

    Volume

    45

    Issue/Number

    12

    Publication Date

    1-1-2001

    Document Type

    Article

    Language

    English

    First Page

    2051

    Last Page

    2056

    WOS Identifier

    WOS:000172552900014

    ISSN

    0038-1101

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