Development of robust interconnect model based on design of experiments and multiobjective optimization

    Authors

    Q. Zhang; J. J. Liou; J. McMacken; J. Thomson;P. Layman

    Comments

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    Abbreviated Journal Title

    IEEE Trans. Electron Devices

    Keywords

    crosstalk; delay; design of experiments; interconnect; multiobjective; optimization; robust TCAD design; COMPUTER EXPERIMENTS; SURFACE; DELAY; Engineering, Electrical & Electronic; Physics, Applied

    Abstract

    When designing an integrated circuit, it is important to take into consideration random variations arising from process variability. Traditional optimization studies on VLSI interconnect attempt to find the deterministic optimum of a cost function but do not take into account the effect of these random variations on the objective. We have developed an effective methodology based on TCAD simulation and design of experiments to optimize interconnect including the effects of process variations. The aim of the study is to search for optimum designs that both meet the performance specification and are robust with respect to process variations. A multiobjective optimization technique known as Normal Boundary Intersection is used to find evenly-spaced tradeoff points on the Pareto curve. Designers can then select designs from the curve without using arbitrary weighting parameters. The proposed methodology was applied to a 0.12 mum CMOS technology; optimization results are discussed and verified using Monte Carlo simulation.

    Journal Title

    Ieee Transactions on Electron Devices

    Volume

    48

    Issue/Number

    9

    Publication Date

    1-1-2001

    Document Type

    Article

    Language

    English

    First Page

    1885

    Last Page

    1891

    WOS Identifier

    WOS:000170644100006

    ISSN

    0018-9383

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