Title

Development of robust interconnect model based on design of experiments and multiobjective optimization

Authors

Authors

Q. Zhang; J. J. Liou; J. McMacken; J. Thomson;P. Layman

Comments

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Abbreviated Journal Title

IEEE Trans. Electron Devices

Keywords

crosstalk; delay; design of experiments; interconnect; multiobjective; optimization; robust TCAD design; COMPUTER EXPERIMENTS; SURFACE; DELAY; Engineering, Electrical & Electronic; Physics, Applied

Abstract

When designing an integrated circuit, it is important to take into consideration random variations arising from process variability. Traditional optimization studies on VLSI interconnect attempt to find the deterministic optimum of a cost function but do not take into account the effect of these random variations on the objective. We have developed an effective methodology based on TCAD simulation and design of experiments to optimize interconnect including the effects of process variations. The aim of the study is to search for optimum designs that both meet the performance specification and are robust with respect to process variations. A multiobjective optimization technique known as Normal Boundary Intersection is used to find evenly-spaced tradeoff points on the Pareto curve. Designers can then select designs from the curve without using arbitrary weighting parameters. The proposed methodology was applied to a 0.12 mum CMOS technology; optimization results are discussed and verified using Monte Carlo simulation.

Journal Title

Ieee Transactions on Electron Devices

Volume

48

Issue/Number

9

Publication Date

1-1-2001

Document Type

Article

Language

English

First Page

1885

Last Page

1891

WOS Identifier

WOS:000170644100006

ISSN

0018-9383

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