Managing heat for electronics

    Authors

    P. K. Schelling; L. Shi;K. E. Goodson

    Comments

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    Abbreviated Journal Title

    Mater. Today

    Keywords

    THERMAL-CONDUCTIVITY; CARBON NANOTUBES; TRANSPORT-PROPERTIES; SILICON; NANOWIRES; SINGLE; NANOSTRUCTURES; CONDUCTANCE; SIMULATION; FILMS; Materials Science, Multidisciplinary

    Abstract

    Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high-conductivity materials. This article reviews recent materials advances with a focus on novel composite substrates and interface materials, including those composites leveraging the high conductivities of carbon nanotubes. Furthermore, attention is given to the special properties of one-dimensional structures that are likely to be of increasing importance in future applications.

    Journal Title

    Materials Today

    Volume

    8

    Issue/Number

    6

    Publication Date

    1-1-2005

    Document Type

    Article

    Language

    English

    First Page

    30

    Last Page

    35

    WOS Identifier

    WOS:000208785200022

    ISSN

    1369-7021

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