Title
Managing heat for electronics
Abbreviated Journal Title
Mater. Today
Keywords
THERMAL-CONDUCTIVITY; CARBON NANOTUBES; TRANSPORT-PROPERTIES; SILICON; NANOWIRES; SINGLE; NANOSTRUCTURES; CONDUCTANCE; SIMULATION; FILMS; Materials Science, Multidisciplinary
Abstract
Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high-conductivity materials. This article reviews recent materials advances with a focus on novel composite substrates and interface materials, including those composites leveraging the high conductivities of carbon nanotubes. Furthermore, attention is given to the special properties of one-dimensional structures that are likely to be of increasing importance in future applications.
Journal Title
Materials Today
Volume
8
Issue/Number
6
Publication Date
1-1-2005
Document Type
Article
Language
English
First Page
30
Last Page
35
WOS Identifier
ISSN
1369-7021
Recommended Citation
"Managing heat for electronics" (2005). Faculty Bibliography 2000s. 5638.
https://stars.library.ucf.edu/facultybib2000/5638
Comments
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