Title

A modified back-etch method for preparation of plan-view high-resolution transmission electron microscopy samples

Authors

Authors

B. Yao; R. V. Petrova; R. R. Vanfleet;K. R. Coffey

Comments

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Abbreviated Journal Title

J. Electron Microsc.

Keywords

back-etch method; TEM; HRTEM; sample preparation; Si; thin films; SPECIMEN PREPARATION; SILICON; Microscopy

Abstract

A modified back-etch method is described that has been successfully used to prepare samples of thin films and nanoparticles on Si wafer substrates for examination by high-resolution transmission electron microscopy ( HRTEM). This process includes ultrasonic cutting, abrasive pre-thinning and a two-stage etching procedure. Unlike previous reports of back-etching methods, tetramethyl ammonium hydroxide, which has a very high-etching selectivity of Si to SiO2, is used for the final etching to allow removal of the Si without degradation of the SiO2 membrane. An innovative wrapping method is also described. This novel approach reduces the preparation time for HRTEM samples to < 1 h per sample for groups of 10 or more samples. As an example, the preparation of FePt nanoparticle samples for HRTEM imaging is described.

Journal Title

Journal of Electron Microscopy

Volume

55

Issue/Number

4

Publication Date

1-1-2006

Document Type

Article

Language

English

First Page

209

Last Page

214

WOS Identifier

WOS:000243496500003

ISSN

0022-0744

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