Mechanical properties of Au films on silicon substrates

    Authors

    Y. Cao; D. D. Nankivil; S. Allameh;W. O. Soboyejo

    Comments

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    Abbreviated Journal Title

    Mater. Manuf. Process.

    Keywords

    Au; hardness; mechanical property; microstructure; modulus; silicon; substrate; thin films; STRAIN GRADIENT PLASTICITY; THIN-FILMS; ELASTIC-MODULUS; INDENTATION; NANOINDENTATION; THICKNESS; GOLD; ALUMINUM; HARDNESS; SCALE; Engineering, Manufacturing; Materials Science, Multidisciplinary

    Abstract

    This paper presents the results of recent studies of the effects of film thickness on the mechanical properties of electron-beam (e-beam) deposited Au films on silicon substrates. Following a brief description of film microstructure and surface topography, film mechanical properties ( Young's modulus and hardness) are determined using nanoindentation techniques. The effects of stiff silicon substrates on the Young's modulus are analyzed within the framework established by King [ 6, 8]. The effects of indentation size on film hardness are also explained within the context of strain gradient plasticity theories and substrate effects. The plasticity length scale parameters are shown to scale with film thickness. The amount of material pile up is also shown to increase with decreasing film thickness, for a given ratio of indentation depth to film thickness. The implications of the work are discussed for applications of Au films on silicon substrates.

    Journal Title

    Materials and Manufacturing Processes

    Volume

    22

    Issue/Number

    2

    Publication Date

    1-1-2007

    Document Type

    Article

    Language

    English

    First Page

    187

    Last Page

    194

    WOS Identifier

    WOS:000246479400009

    ISSN

    1042-6914

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