Interconnecting fluidic packages and interfaces for micromachined sensors

    Authors

    M. Pepper; N. S. Palsandram; P. Zhang; M. Lee;H. J. Cho

    Comments

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    Abbreviated Journal Title

    Sens. Actuator A-Phys.

    Keywords

    interconnection; microfluidic package; sensor interface; portable; analysis system; HIGH-TEMPERATURE; PRESSURE; SYSTEMS; Engineering, Electrical & Electronic; Instruments & Instrumentation

    Abstract

    In the design and realization of a portable chemical analysis system, adequate partitioning of reusable components and disposable components is demanded. Successful implementation of micromachined sensors in measurement instrumentation and interfacing between the micro- and macro-scale elements of the system require reliable methods for interconnection of these components. This work has investigated interconnection methods of disposable micromachined chip devices, reusable microfluidic packaging, and a hybrid fluidic interface system. Two novel solutions were developed which consist of a one-piece (type I) microfluidic package for flow-through analysis and a two-piece (type II) fluidic package for plug-in operation that could house a micromachined device in contact with liquid phase samples. These packages were designed to have compatibility with standardized tubing sizes and easy snap-in connectivity. The packages were tested mechanically and their applications were demonstrated with electrochemical sensors. (c) 2006 Elsevier B.V. All rights reserved.

    Journal Title

    Sensors and Actuators a-Physical

    Volume

    134

    Issue/Number

    1

    Publication Date

    1-1-2007

    Document Type

    Article; Proceedings Paper

    Language

    English

    First Page

    278

    Last Page

    285

    WOS Identifier

    WOS:000245066000033

    ISSN

    0924-4247

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