Title

Interconnecting fluidic packages and interfaces for micromachined sensors

Authors

Authors

M. Pepper; N. S. Palsandram; P. Zhang; M. Lee;H. J. Cho

Comments

Authors: contact us about adding a copy of your work at STARS@ucf.edu

Abbreviated Journal Title

Sens. Actuator A-Phys.

Keywords

interconnection; microfluidic package; sensor interface; portable; analysis system; HIGH-TEMPERATURE; PRESSURE; SYSTEMS; Engineering, Electrical & Electronic; Instruments & Instrumentation

Abstract

In the design and realization of a portable chemical analysis system, adequate partitioning of reusable components and disposable components is demanded. Successful implementation of micromachined sensors in measurement instrumentation and interfacing between the micro- and macro-scale elements of the system require reliable methods for interconnection of these components. This work has investigated interconnection methods of disposable micromachined chip devices, reusable microfluidic packaging, and a hybrid fluidic interface system. Two novel solutions were developed which consist of a one-piece (type I) microfluidic package for flow-through analysis and a two-piece (type II) fluidic package for plug-in operation that could house a micromachined device in contact with liquid phase samples. These packages were designed to have compatibility with standardized tubing sizes and easy snap-in connectivity. The packages were tested mechanically and their applications were demonstrated with electrochemical sensors. (c) 2006 Elsevier B.V. All rights reserved.

Journal Title

Sensors and Actuators a-Physical

Volume

134

Issue/Number

1

Publication Date

1-1-2007

Document Type

Article; Proceedings Paper

Language

English

First Page

278

Last Page

285

WOS Identifier

WOS:000245066000033

ISSN

0924-4247

Share

COinS