Optical substrate thickness measurement system using hybrid fiber-freespace optics and selective wavelength interferometry

    Authors

    N. A. Riza; M. Sheikh;F. Perez

    Comments

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    Abbreviated Journal Title

    Opt. Commun.

    Keywords

    INTRAOCULAR DISTANCES; WHITE-LIGHT; CONSTANTS; INDEX; PHASE; LASER; Optics

    Abstract

    Proposed and demonstrated is a simple few components non-contact thickness measurement system for optical quality semi-transparent samples such as Silicon (Si) and 6H Silicon Carbide (SiC) optical chips used for designing sensors. The instrument exploits a hybrid fiber-freespace optical design that enables self-calibrating measurements via the use of confocal imaging via single mode fiber-optics and a self-imaging type optical fiber collimating lens. Data acquisition for fault-tolerant measurements is accomplished via a sufficiently broadband optical source and a tunable laser and relevant wavelength discriminating optics. Accurate sample thickness processing is achieved using the known material dispersion-data for the sample and the few (e.g., 5) accurately measured optical power null wavelengths produced via the sample etalon effect. Thicknesses of 281.1 mu m and 296 mu m are measured for given SiC and Si optical chips, respectively. (c) 2006 Elsevier B.V. All rights reserved.

    Journal Title

    Optics Communications

    Volume

    269

    Issue/Number

    1

    Publication Date

    1-1-2007

    Document Type

    Article

    Language

    English

    First Page

    24

    Last Page

    29

    WOS Identifier

    WOS:000242671000004

    ISSN

    0030-4018

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