Electrospray cooling for microelectronics

    Authors

    W. W. Deng;A. Gomez

    Comments

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    Abbreviated Journal Title

    Int. J. Heat Mass Transf.

    Keywords

    Spray cooling; MEMS; Electrospray; HEAT-TRANSFER; SOLID-SURFACE; DROPLET; IMPACT; IMPINGEMENT; TEMPERATURE; DEPOSITION; LIQUIDS; MICRO; Thermodynamics; Engineering, Mechanical; Mechanics

    Abstract

    The challenge of effectively removing high heat flux from microelectronic chips may hinder future advancements in the semiconductor industry. Spray cooling is a promising solution to dissipate high heat flux, but traditional sprays suffer from low cooling efficiency partly because of droplet rebound. Here we show that electrosprays provide highly efficient cooling by completely avoiding the droplet rebound, when the electrically charged droplets are pinned on the heated conducting surface by the electric image force. We demonstrate a cooling system consisting of microfabricated multiplexed electrosprays in the cone-jet mode generating electrically charged microdroplets that remove a heat flux of 96 W/cm(2) with a cooling efficiency reaching 97%. Scale-up considerations suggest that the electrospray approach is well suited for practical applications by increasing the level of multiplexing and by preserving the system compactness using microfabrication. (C) 2011 Elsevier Ltd. All rights reserved.

    Journal Title

    International Journal of Heat and Mass Transfer

    Volume

    54

    Issue/Number

    11-12

    Publication Date

    1-1-2011

    Document Type

    Article

    Language

    English

    First Page

    2270

    Last Page

    2275

    WOS Identifier

    WOS:000289820100004

    ISSN

    0017-9310

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