Evaluation of Compact and Effective Air-Cooled Carbon Foam Heat Sink

    Authors

    W. Wu; J. H. Du; Y. R. Lin; L. C. Chow; H. Bostanci; B. A. Saarloos;D. P. Rini

    Comments

    Authors: contact us about adding a copy of your work at STARS@ucf.edu

    Abbreviated Journal Title

    J. Heat Transf.-Trans. ASME

    Keywords

    carbon foam; thermal management; electronics cooling; THERMAL MANAGEMENT; FLUID; Thermodynamics; Engineering, Mechanical

    Abstract

    This study investigates a V-shaped corrugated carbon foam heat sink for thermal management of electronics with forced air convection. Experiments were conducted to determine the heat sink performance in terms of heat transfer coefficient and pressure drop. The test section, with overall dimensions of 51 mm L x 51 mm W x 19 mm H, enabled up to 166 W of heat dissipation, and 3280 W/m(2) K and 2210 W/m(2) K heat transfer coefficients, based on log mean and air inlet temperatures, respectively, at 7.8 m/s air flow speed, and 1320 Pa pressure loss. Compared to a solid carbon foam, the V-shaped corrugated structure enhances the heat transfer, and at the same time reduces the flow resistance. Physical mechanisms underlying the observed phenomena are briefly explained. With benefits that potentially can reduce overall weight, volume, and cost of the air-cooled electronics, the present V-shaped corrugated carbon foam emerges as an alternative heat sink. [DOI: 10.1115/1.4003193]

    Journal Title

    Journal of Heat Transfer-Transactions of the Asme

    Volume

    133

    Issue/Number

    5

    Publication Date

    1-1-2011

    Document Type

    Article

    Language

    English

    First Page

    5

    WOS Identifier

    WOS:000286989800020

    ISSN

    0022-1481

    Share

    COinS