Grain Boundary Character Distribution of Nanocrystalline Cu Thin Films Using Stereological Analysis of Transmission Electron Microscope Orientation Maps

    Authors

    A. D. Darbal; K. J. Ganesh; X. Liu; S. B. Lee; J. Ledonne; T. Sun; B. Yao; A. P. Warren; G. S. Rohrer; A. D. Rollett; P. J. Ferreira; K. R. Coffey;K. Barmak

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    Abbreviated Journal Title

    Microsc. microanal.

    Keywords

    stereology; orientation mapping; grain boundary character distribution; precession microscopy; IMAGING MICROSCOPY; DIFFRACTION; PATTERNS; METALS; INTENSITIES; ENERGIES; SURFACES; NICKEL; COPPER; TEM; Materials Science, Multidisciplinary; Microscopy

    Abstract

    Stereological analysis has been coupled with transmission electron microscope (TEM) orientation mapping to investigate the grain boundary character distribution in nanocrystalline copper thin films. The use of the nanosized ( < 5 nm) beam in the TEM for collecting spot diffraction patterns renders an order of magnitude improvement in spatial resolution compared to the analysis of electron backscatter diffraction patterns in the scanning electron microscope. Electron beam precession is used to reduce dynamical effects and increase the reliability of orientation solutions. The misorientation distribution function shows a strong misorientation texture with a peak at 60 degrees/[111], corresponding to the Sigma 3 misorientation. The grain boundary plane distribution shows {111} as the most frequently occurring plane, indicating a significant population of coherent twin boundaries. This study demonstrates the use of nanoscale orientation mapping in the TEM to quantify the five-parameter grain boundary distribution in nanocrystalline materials.

    Journal Title

    Microscopy and Microanalysis

    Volume

    19

    Issue/Number

    1

    Publication Date

    1-1-2013

    Document Type

    Article

    Language

    English

    First Page

    111

    Last Page

    119

    WOS Identifier

    WOS:000314426400013

    ISSN

    1431-9276

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