A Fully-Integrated Flexible Photonic Platform for Chip-to-Chip Optical Interconnects

    Authors

    L. Li; Y. Zou; H. T. Lin; J. J. Hu; X. C. Sun; N. N. Feng; S. Danto; K. Richardson; T. Gu;M. Haney

    Comments

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    Abbreviated Journal Title

    Anat. Sci. Educ.

    Keywords

    Data communications; energy per bit; optical interconnects; optical; waveguides; WAVE-GUIDES; CHALCOGENIDE GLASS; SILICON PHOTONICS; CIRCUIT-BOARD; FABRICATION; RESONATORS; CMOS; Engineering, Electrical & Electronic; Optics; Telecommunications

    Abstract

    We analyze a chip-to-chip optical interconnect platform based on our recently developed flexible substrate integration technology. We show that the architecture achieves high bandwidth density (100 Tbs/cm(2)), and does not require optical alignment during packaging. These advantages make the flexible photonics platform a promising solution for chip-to-chip optical interconnects. We further report initial experimental characterizations of the flexible photonics platform fabricated using thermal nanoimprint patterning of glass waveguides and III-V die bonding.

    Journal Title

    Journal of Lightwave Technology

    Volume

    J. Lightwave Technol.

    Issue/Number

    24

    Publication Date

    1-1-2013

    Document Type

    Article

    Language

    English

    First Page

    4080

    Last Page

    4086

    WOS Identifier

    31

    ISSN

    0733-8724

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