Title

A Fully-Integrated Flexible Photonic Platform for Chip-to-Chip Optical Interconnects

Authors

Authors

L. Li; Y. Zou; H. T. Lin; J. J. Hu; X. C. Sun; N. N. Feng; S. Danto; K. Richardson; T. Gu;M. Haney

Comments

Authors: contact us about adding a copy of your work at STARS@ucf.edu

Abbreviated Journal Title

Anat. Sci. Educ.

Keywords

Data communications; energy per bit; optical interconnects; optical; waveguides; WAVE-GUIDES; CHALCOGENIDE GLASS; SILICON PHOTONICS; CIRCUIT-BOARD; FABRICATION; RESONATORS; CMOS; Engineering, Electrical & Electronic; Optics; Telecommunications

Abstract

We analyze a chip-to-chip optical interconnect platform based on our recently developed flexible substrate integration technology. We show that the architecture achieves high bandwidth density (100 Tbs/cm(2)), and does not require optical alignment during packaging. These advantages make the flexible photonics platform a promising solution for chip-to-chip optical interconnects. We further report initial experimental characterizations of the flexible photonics platform fabricated using thermal nanoimprint patterning of glass waveguides and III-V die bonding.

Journal Title

Journal of Lightwave Technology

Volume

J. Lightwave Technol.

Issue/Number

24

Publication Date

1-1-2013

Document Type

Article

Language

English

First Page

4080

Last Page

4086

WOS Identifier

31

ISSN

0733-8724

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