Title

Modeling, Design, and Characterization of Multiturn Bondwire Inductors With Ferrite Epoxy Glob Cores for Power Supply System-on-Chip or System-in-Package Applications

Authors

Authors

J. Lu; H. W. Jia; X. X. Wang; K. Padmanabhan; W. G. Hurley;Z. J. Shen

Comments

Authors: contact us about adding a copy of your work at STARS@ucf.edu

Abbreviated Journal Title

IEEE Trans. Power Electron.

Keywords

Ferrite; on-chip magnetics; power supply system-on-package (PSiP); power; supply system-on-chip (PsoC); wirebond; MICROINDUCTORS; CONVERTER; SILICON; Engineering, Electrical & Electronic

Abstract

The concept of coupled multiturn bondwire inductors with ferrite epoxy glob cores is investigated both experimentally and numerically to offer a cost-effective approach realizing power supply system-on-chip (PSoC) or system-in-package (PSiP). Improvement in total inductance and Q factor is demonstrated for the multiturn bondwire inductors due to the coupling effect. An empirical calculation method is developed to help determine the self and mutual inductance of the proposed bondwire inductors. The bondwire magnetic components can be easily integrated into IC packaging processes with minimal changes, and open possibilities for realizing cost-effective, high-current, and high-efficiency PSoCs or PSiPs.

Journal Title

Ieee Transactions on Power Electronics

Volume

25

Issue/Number

8

Publication Date

1-1-2010

Document Type

Article

Language

English

First Page

2010

Last Page

2017

WOS Identifier

WOS:000281833300008

ISSN

0885-8993

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