Modeling, Design, and Characterization of Multiturn Bondwire Inductors With Ferrite Epoxy Glob Cores for Power Supply System-on-Chip or System-in-Package Applications

    Authors

    J. Lu; H. W. Jia; X. X. Wang; K. Padmanabhan; W. G. Hurley;Z. J. Shen

    Comments

    Authors: contact us about adding a copy of your work at STARS@ucf.edu

    Abbreviated Journal Title

    IEEE Trans. Power Electron.

    Keywords

    Ferrite; on-chip magnetics; power supply system-on-package (PSiP); power; supply system-on-chip (PsoC); wirebond; MICROINDUCTORS; CONVERTER; SILICON; Engineering, Electrical & Electronic

    Abstract

    The concept of coupled multiturn bondwire inductors with ferrite epoxy glob cores is investigated both experimentally and numerically to offer a cost-effective approach realizing power supply system-on-chip (PSoC) or system-in-package (PSiP). Improvement in total inductance and Q factor is demonstrated for the multiturn bondwire inductors due to the coupling effect. An empirical calculation method is developed to help determine the self and mutual inductance of the proposed bondwire inductors. The bondwire magnetic components can be easily integrated into IC packaging processes with minimal changes, and open possibilities for realizing cost-effective, high-current, and high-efficiency PSoCs or PSiPs.

    Journal Title

    Ieee Transactions on Power Electronics

    Volume

    25

    Issue/Number

    8

    Publication Date

    1-1-2010

    Document Type

    Article

    Language

    English

    First Page

    2010

    Last Page

    2017

    WOS Identifier

    WOS:000281833300008

    ISSN

    0885-8993

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