Graphene-Based Heat Spreader for Flexible Electronic Devices

    Authors

    S. H. Bae; R. Shabani; J. B. Lee; S. J. Baeck; H. J. Cho;J. H. Ahn

    Comments

    Authors: contact us about adding a copy of your work at STARS@ucf.edu

    Abbreviated Journal Title

    IEEE Trans. Electron Devices

    Keywords

    Chemical vapor deposition (CVD); chip-on-film; graphene; heat spreader; thermal conductivity; THERMAL MANAGEMENT; PHONON TRANSPORT; SOLAR-CELLS; FILMS; CONDUCTIVITY; ANODE; Engineering, Electrical & Electronic; Physics, Applied

    Abstract

    Graphene known for its superb physical properties, such as high transparency and thermal conductivity, is proposed as a solution to the problem of thermal management of the electronic devices, requiring transparency and cooling. It is shown that graphene heat spreader layer drives the heat out of the device more efficiently as compared with the commercially used metal thin films for integrated circuit cooling. An application of graphene heat spreader is proposed and tested in chip-on-film packaging. Graphene performance is compared with a gold layer with a similar transparency experimentally and theoretically as a proof of the efficient thermal management capability of graphene.

    Journal Title

    Ieee Transactions on Electron Devices

    Volume

    61

    Issue/Number

    12

    Publication Date

    1-1-2014

    Document Type

    Article

    Language

    English

    First Page

    4171

    Last Page

    4175

    WOS Identifier

    WOS:000346573600034

    ISSN

    0018-9383

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