Title

Power amplifier resilient design for process and temperature variations using an on-chip PLL sensing signal

Authors

Authors

J. S. Yuan;S. Chen

Comments

Authors: contact us about adding a copy of your work at STARS@ucf.edu

Abbreviated Journal Title

Microelectron. Reliab.

Keywords

Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Physics, Applied

Abstract

This paper presents RF power amplifier adaptive body bias compensation technique for output power and power-added efficiency resilience to process and temperature variations. The adaptive body biasing scheme uses a phase-lock loop for variability sensing to provide resilience through the threshold voltage adjustment to maintain power amplifier performance over a wide range of variability. Analytical equations are derived for physical insight. Circuit simulation results show that the adaptive body biasing design improves the robustness of the power amplifier in output power and power-added efficiency over process and temperature variations. (C) 2013 Elsevier Ltd. All rights reserved.

Journal Title

Microelectronics Reliability

Volume

54

Issue/Number

1

Publication Date

1-1-2015

Document Type

Article

Language

English

First Page

167

Last Page

171

WOS Identifier

WOS:000331342800023

ISSN

0026-2714

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