Grain size dependence of the twin length fraction in nanocrystalline Cu thin films via transmission electron microscopy based orientation mapping

Authors

    Authors

    X. Liu; N. T. Nuhfer; A. P. Warren; K. R. Coffey; G. S. Rohrer;K. Barmak

    Comments

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    Abbreviated Journal Title

    J. Mater. Res.

    Keywords

    BOUNDARY-CHARACTER-DISTRIBUTION; ANNEALING TWINS; FCC METALS; BACKSCATTER DIFFRACTION; COPPER; ENERGIES; CRYSTALS; TEXTURE; CONDUCTIVITY; POLYCRYSTALS; Materials Science, Multidisciplinary

    Abstract

    Transmission electron microscopy (TEM) based orientation mapping has been used to measure the length fraction of coherent and incoherent Sigma 3 grain boundaries in a series of six nanocrystalline Cu thin films with thicknesses in the range of 26-111 nm and grain sizes from 51 to 315 nm. The films were annealed at the same temperature (600 degrees C) for the same length of time (30 min), have random texture, and vary only in grain size and film thickness. A strong grain size dependence of Sigma 3 (coherent and incoherent) and coherent Sigma 3 boundary fraction was observed. The experimental results are quantitatively compared with three physical models for the formation of annealing twins developed for microscale materials. The experimental results for the nanoscale Cu films are found to be in good agreement with the two microscale models that explain twin formation as a growth accident process.

    Journal Title

    Journal of Materials Research

    Volume

    30

    Issue/Number

    4

    Publication Date

    1-1-2015

    Document Type

    Article

    Language

    English

    First Page

    528

    Last Page

    537

    WOS Identifier

    WOS:000350633500009

    ISSN

    0884-2914

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