Controlled electroplating and electromigration in nickel electrodes for nanogap formation

    Authors

    L. Valladares; L. L. Felix; A. B. Dominguez; T. Mitrelias; F. Sfigakis; S. I. Khondaker; C. H. W. Barnes;Y. Majima

    Comments

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    Abbreviated Journal Title

    Nanotechnology

    Keywords

    NANOMETER-SPACED ELECTRODES; ATOMIC-SIZE CONTACTS; BALLISTIC; MAGNETORESISTANCE; CONDUCTANCE QUANTIZATION; ROOM-TEMPERATURE; METALLIC; ELECTRODES; QUANTUM CONDUCTANCE; GOLD NANOPARTICLES; NI NANOCONTACTS; POINT CONTACTS; Nanoscience & Nanotechnology; Materials Science, Multidisciplinary; Physics, Applied

    Abstract

    We report the fabrication of nickel nanospaced electrodes by electroplating and electromigration for nanoelectronic devices. Using a conventional electrochemical cell, nanogaps can be obtained by controlling the plating time alone and after a careful optimization of electrodeposition parameters such as electrolyte bath, applied potential, cleaning, etc. During the process, the gap width decreases exponentially with time until the electrode gaps are completely bridged. Once the bridge is formed, the ex situ electromigration technique can reopen the nanogap. When the gap is similar to 1 nm, tunneling current-voltage characterization shows asymmetry which can be corrected by an external magnetic field. This suggests that charge transfer in the nickel electrodes depends on the orientation of magnetic moments.

    Journal Title

    Nanotechnology

    Volume

    21

    Issue/Number

    44

    Publication Date

    1-1-2010

    Document Type

    Article

    Language

    English

    First Page

    8

    WOS Identifier

    WOS:000282679800009

    ISSN

    0957-4484

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