Abstract
A one-piece, microfluidic package with standardized multiple ports allows devices to be connected in series without resorting to extra tubing connections or bonding 5 processes. The one-piece construction consists of microfluidic channels that can be connected to fluid reservoirs and other fluidic components fabricated with interconnecting and interlocking ports. The size of the friction-fit interlocking ports is designed such that the smaller male port fits snugly into the larger female port in a manner that is leak-free and adhesive-fiee. The friction-fit ports can also be 10 reconfigured. Thus, the interconnection of microfluidic packages can be in an extended series including connections to sensors and devices such as a bio/biochemical/chemical sensor chip, a dielectrophoretic manipulator chip, and a microfluidic reactor chip.
Document Type
Patent
Patent Number
US 7,988,902
Application Serial Number
12/459,931
Issue Date
8-2-2011
Current Assignee
UCFRF
Assignee at Issuance
UCFRF
College
College of Engineering and Computer Science (CECS)
Department
Mechanical and Aerospace Engineering
Allowance Date
3-21-2011
Filing Date
7-9-2009
Assignee at Filing
UCFRF
Filing Type
Nonprovisional Application Record
Donated
no
Recommended Citation
Cho, Hyoung, "Interconnecting Microfluidic Package and Fabrication Method DIV" (2011). UCF Patents. 276.
https://stars.library.ucf.edu/patents/276