Abstract
A one-piece, microfluidic package with standardized multiple ports allows devices to be connected in series without resorting to extra tubing connections or bonding 5 processes. The one-piece construction consists of microfluidic channels that can be connected to fluid reservoirs and other fluidic components fabricated with interconnecting and interlocking ports. The size of the friction-fit interlocking ports is designed such that the smaller male port fits snugly into the larger female port in a manner that is leak-free and adhesive-fiee. The friction-fit ports can also be 10 reconfigured. Thus, the interconnection of microfluidic packages can be in an extended series including connections to sensors and devices such as a bio/biochemical/chemical sensor chip, a dielectrophoretic manipulator chip, and a microfluidic reactor chip.
Document Type
Patent
Patent Number
US 7,569,127
Application Serial Number
11/044,494
Issue Date
8-4-2009
Current Assignee
UCFRF
Assignee at Issuance
UCFRF
College
College of Engineering and Computer Science (CECS)
Department
Mechanical and Aerospace Engineering
Allowance Date
4-27-2009
Filing Date
1-27-2005
Assignee at Filing
UCFRF
Filing Type
Nonprovisional Application Record
Donated
no
Recommended Citation
Cho, Hyoung, "Interconnecting Microfluidic Package and Fabrication Method" (2009). UCF Patents. 277.
https://stars.library.ucf.edu/patents/277